Uhlalutyo Lomzimba Olonakalisayo
Intshayelelo yeNkonzo
I-GRGT ibonelela ngohlalutyo olutshabalalisayo lomzimba (i-DPA) lwamacandelo aquka amacandelo angenziwanga, izixhobo ezidityanisiweyo kunye neesekethe ezihlanganisiweyo.
Kwiinkqubo eziphambili ze-semiconductor, amandla e-DPA agubungela ii-chips ezingaphantsi kwe-7nm, iingxaki zinokuvalelwa kuluhlu oluthile lwe-chip okanye umgama;kwi-aerospace-level-level-seal-sealing components kunye neemfuno zokulawula umphunga wamanzi, i-PPM-level ye-PPM-level yangaphakathi yohlalutyo lokubumba umphunga wamanzi unokwenziwa ukuze kuqinisekiswe iimfuno ezikhethekileyo zokusetyenziswa kwamacandelo okutywinwa komoya.
Umda weNkonzo
Iitshiphu zesekethe ezidityanisiweyo, izixhobo zombane, izixhobo ezidityanisiweyo, izixhobo ze-electromechanical, iintambo kunye neziqhagamshelo, i-microprocessors, izixhobo ezicwangciswayo ezicwangcisiweyo, imemori, i-AD/DA, i-interfaces yebhasi, iisekethe zedijithali ngokubanzi, ukutshintshwa kwe-analog, izixhobo ze-analog, izixhobo ze-microwave, izixhobo zombane, njl.
Imigangatho yovavanyo
● Indlela yokuvavanya isixhobo se-GJB128A-97 Semiconductor discrete
● I-GJB360A-96 indlela yokuvavanya amacandelo ombane kunye nombane
● I-GJB548B-2005 Iindlela zokuvavanya izixhobo zeMicroelectronic kunye neenkqubo
● I-GJB7243-2011 yokuHlola iiMfuno zobuGcisa kwiMicimbi yoMkhosi woMkhosi.
● I-GJB40247A-2006 Indlela yoHlalutyo loMzimba olonakalisayo kuMacandelo oMkhosi woMkhosi.
● I-QJ10003-2008 Isikhokelo sokuHlola kwiiNdawo eziThunyelwe ngaphandle
● Indlela yokuvavanya isixhobo se-MIL-STD-750D semiconductor discrete
● I-MIL-STD-883G iindlela zovavanyo lwesixhobo se-microelectronic kunye neenkqubo
Izinto zovavanyo
| Uhlobo lovavanyo | Izinto zovavanyo |
| Izinto ezingonakalisi | Uhlolo olubonakalayo lwangaphandle, uhlolo lweX-reyi, PIND, ukutywinwa, amandla etheminali, uhlolo lwe-acoustic microscope |
| Into eyonakalisayo | I-laser de-capsulation, ikhemikhali ye-e-capsulation, uhlalutyo lokubunjwa kwegesi yangaphakathi, ukuhlolwa okubonakalayo kwangaphakathi, ukuhlolwa kwe-SEM, amandla okubopha, amandla okucheba, amandla okunamathela, i-chip delamination, ukuhlolwa kwe-substrate, i-PN junction dyeing, i-DB FIB, ukubonwa kweendawo ezishushu, indawo yokuvuza. ukufunyanwa, ukufunyanwa kwecrater, uvavanyo lweESD |
