Ukugubungela idijithali, i-analog, i-digital-analog hybrid kunye nezinye iindidi ze-chip.
● Uyilo lwehardware yovavanyo lweCP
I-hardware yovavanyo likhadi lephini, lisetyenziselwa ukudibanisa ngokomzimba phakathi kwe-ATE kunye ne-DIE.
● Uyilo lwe-hardware yovavanyo lwe-FT
Ihardware yovavanyo yi-loadboard+socket+changekit, esetyenziselwa ukuvavanya unxibelelwano lomzimba phakathi kwesixhobo kunye netshiphu epakishiweyo.
● Ukuqinisekiswa komgangatho webhodi
Ukwakha indawo yokusebenza yetshiphu "efanisiweyo", vavanya umsebenzi wetshiphu okanye ujonge ukuba itshiphu inokusebenza ngokuqhelekileyo kwiindawo ezahlukeneyo ezirhabaxa.
● Uvavanyo lwe-SLT
Umsebenzi wokuvavanya kwimeko yenkqubo ukufumanisa umgangatho, kunye neendlela ezongezelelweyo ze-FT, ngokukodwa kwizixhobo zeSOC.
I-Integrated Circuit Testing and Analysis Division iphambili yovavanyo lomgangatho wasekhaya semiconductor kunye nenkqubo yokuphucula ukuthembeka komnikezeli wenkonzo yobugcisa, utyale imali engaphezu kwama-300 yovavanyo oluphezulu kunye nezixhobo zokuhlalutya, waqulunqa iqela letalente kunye noogqirha kunye neengcali njengondoqo, kwaye wenza i-8. imifuniselo ekhethekileyo.Ibonelela ngohlalutyo lobuchwephesha lokungaphumeleli kunye nokuveliswa kwenqanaba le-wafer kumashishini akwimimandla yokwenziwa kwezixhobo, iimoto, umbane wamandla ombane kunye namandla amatsha, unxibelelwano lwe-5G, izixhobo ze-optoelectronic kunye nezinzwa, ukuhamba koololiwe kunye nezixhobo, kunye neempahla.Uhlalutyo lwenkqubo, ukuhlolwa kwecandelo, uvavanyo lokuthembeka, uvavanyo lomgangatho wenkqubo, ukuqinisekiswa kwemveliso, uvavanyo lobomi kunye nezinye iinkonzo zinceda iinkampani ukuba ziphucule umgangatho kunye nokuthembeka kweemveliso ze-elektroniki.
Amaxabiso ethu axhomekeke ekutshintsheni ngokuxhomekeke kubonelelo kunye neminye imiba yemarike.Siza kukuthumelela uluhlu lwamaxabiso oluhlaziyiweyo emva kokuba inkampani yakho iqhagamshelane nathi ngolwazi oluthe vetshe.