Uhlalutyo lwe-Microstructure kunye novavanyo lwezixhobo ze-semiconductor
Intshayelelo yeNkonzo
Ngophuhliso oluqhubekayo lweesekethe ezinkulu ezihlanganisiweyo, inkqubo yokuvelisa i-chip iya isiba nzima ngakumbi, kwaye i-microstructure engaqhelekanga kunye nokubunjwa kwezixhobo ze-semiconductor zithintela ukuphuculwa kwemveliso ye-chip, ezisa imingeni enkulu ekuphunyezweni kwe-semiconductor entsha kunye nobuchwepheshe besekethe obudibeneyo.
I-GRGTEST ibonelela ngohlalutyo olubanzi lwe-semiconductor ye-microstructure kunye novavanyo lokunceda abathengi baphucule i-semiconductor kunye neenkqubo zesekethe ezidibeneyo, kubandakanywa nokulungiselela iprofayili yenqanaba le-wafer kunye nohlalutyo lwe-elektroniki, uhlalutyo olubanzi lweempawu ezibonakalayo kunye neekhemikhali zezixhobo ezinxulumene nokuveliswa kwe-semiconductor, ukuqulunqwa kunye nokuphunyezwa kwenkqubo yohlalutyo lwezinto ezingcolisayo ze-semiconductor.
Umda wenkonzo
Imathiriyeli yeSemiconductor, imathiriyeli encinci ephilayo yemolekyuli, imathiriyeli yepolymer, imathiriyeli ye-organic/inorganic hybrid, imathiriyeli engeyiyo eyentsimbi.
Inkqubo yenkonzo
1. Ukulungiswa kweprofayili ye-chip wafer kunye nohlalutyo lwe-elektroniki, olusekelwe kwi-teknoloji ye-ion beam (i-DB-FIB), ukusika ngokuchanekileyo kwendawo yendawo ye-chip, kunye ne-real-time imaging electronic, inokufumana isakhiwo seprofayili ye-chip, ukubunjwa kunye nolunye ulwazi olubalulekileyo lwenkqubo;
2. Uhlalutyo olubanzi lweempawu ezibonakalayo kunye neekhemikhali zezinto zokwenziwa kwe-semiconductor, kubandakanywa izixhobo ze-polymer eziphilayo, izinto ezincinci ze-molecule, uhlalutyo lwe-inorganic non-metallic ukwakheka kwezinto, uhlalutyo lwesakhiwo semolekyuli, njl.
3. Ukuqulunqwa kunye nokuphunyezwa kwesicwangciso sokuhlalutya ungcoliseko kwizinto ze-semiconductor. Inokunceda abathengi baqonde ngokupheleleyo iimpawu ezibonakalayo kunye neekhemikhali zokungcola, kubandakanywa: uhlalutyo lwemichiza, uhlalutyo lomxholo wecandelo, uhlalutyo lwesakhiwo se-molecular kunye nolunye uhlalutyo lweempawu zomzimba kunye neekhemikhali.
Izinto zeNkonzo
| Inkonzouhlobo | Inkonzoizinto |
| Uhlalutyo lokubunjwa kwezinto ezisisiseko semiconductor | l Uhlalutyo olusisiseko lwe-EDS, l X-ray photoelectron spectroscopy (XPS) uhlalutyo elemental |
| Uhlalutyo lwesakhiwo semolekyuli yezinto eziphathekayo ze-semiconductor | l FT-IR uhlalutyo lwe-infrared spectrum, l I-X-ray diffraction (XRD) uhlalutyo lwe-spectroscopic, l Uhlalutyo lwe-Nuclear magnetic resonance pop (H1NMR, C13NMR) |
| Uhlalutyo lwe-Microstructure yezinto ze-semiconductor | l Uhlalutyo lwesilayi se-ion egxininiswe kabini (DBFIB), l I-Fiel emission scanning electron microscopy (FESEM) yasetyenziselwa ukulinganisa nokujonga i-morphology ye-microscopic, l I-Atomic force microscopy (AFM) yoqwalaselo lwemophology yomphezulu |
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