Ukuze ukuziqhelanisa nokwanda ingqalelo ngamazwe ukukhuselwa kokusingqongileyo, PCBA watshintsha ukusuka kukhokelela kukhokelela inkqubo simahla, kwaye isicelo izinto ezintsha laminate, olu tshintsho luya kubangela PCB iimveliso zombane solder utshintsho yokusebenza ngokubambisana.Ngenxa yokuba amalungu e-solder abuthathaka kakhulu kukusilela koxinzelelo, kubalulekile ukuqonda iimpawu zoxinzelelo lwe-PCB yombane phantsi kwezona meko zinzima ngovavanyo loxinzelelo.
Kwii-alloys ezahlukeneyo ze-solder, iintlobo zeepakethi, unyango olungaphezulu okanye izinto ezilayilethisiweyo, uxinzelelo olugqithisileyo lunokukhokelela kwiindlela ezahlukeneyo zokusilela.Ukungaphumeleli kubandakanya ukuqhekeka kwebhola ye-solder, umonakalo we-wiring, ukungaphumeleli kwe-laminate yokudibanisa (i-pad skewing) okanye ukungaphumeleli kokubambisana (i-pad pitting), kunye nokuqhekeka kwe-substrate yephakheji (jonga uMzobo 1-1).Ukusetyenziswa komlinganiselo wobunzima bokulawula ukuguqulwa kweebhodi eziprintiweyo kubonakalise ukuba luncedo kwishishini le-elektroniki kwaye ufumana ukwamkelwa njengendlela yokuchonga nokuphucula imisebenzi yemveliso.
Uvavanyo loxinzelelo lubonelela ngohlalutyo lwenjongo yenqanaba loxinzelelo kunye nenqanaba loxinzelelo oluphantsi kwepakethe ye-SMT ngexesha lendibano ye-PCBA, uvavanyo, kunye nokusebenza, ukubonelela ngendlela yobuninzi be-PCB yokulinganisa i-warpage kunye novavanyo lokulinganisa umngcipheko.
Injongo yokulinganisa ubunzima kukuchaza iimpawu zawo onke amanyathelo okuhlanganisa abandakanya imithwalo yomatshini.
Ixesha lokuposa: Apr-19-2024